Wafer Grippers SWGm Wet
Specially positioned and dimensioned suction points enable safe handling of wet wafers
Extremely fast and accurate handling thanks to low height and weight
High suction capacity allows safe gripping even with partial occupancy or leakage e.g. with perforated wafers
Controlled discharge of sucked air (optional) prevents contamination of the process area
Quick release function enables precise wafer positioning
Design
Design
- Base model version with discharging exhaust air (3) in axial (A) or lateral (S) direction
- Suction area geometries available in common cell sizes 125 mm and 156 mm (5" and 6")
- Optional component (II) for controlled discharging of exhaust air
- Modular design with accessories for the mounting of sensors and modules for suction and damping (I) and a selection of flange modules (III)
- Minimal overall height through reduced-weight plastic design
Technical Data
Technical Data
- Dimensions: 115 x 115 mm and 146 x 146 mm
- Basic version with side exhaust
- Material suction surface: PEEK
Documentation
Documentation
The matching documentation for this product is available in this section.
| Documents | Language |
|---|---|
| English |